Pax Silica Summit Invitation

Department of State

On June 25 and 26, at the U.S. Department of State, Under Secretary of Economic Affairs Jacob Helberg will host a two-day Summit for Pax Silica partner economies. Participants will include current Pax Silica Declaration signatories, representatives from affiliate economies, and senior executives from leading companies building and financing the technologies that will underpin the AI era. Members of the press are invited to cover the Summit launch, opening remarks, special announcements, and a signing ceremony as the Summit advances international cooperation to strengthen trusted AI supply chains, expand investment and innovation, deepen collaboration on critical minerals, energy, semiconductors, and compute infrastructure, and promote a pro-growth environment for AI development.

Pax Silica is the Department of State's flagship effort to strengthen economic security through trusted technology partnerships. The initiative serves as a platform for governments and industry to coordinate investment, align market incentives, and accelerate the development of strategic industries critical to the AI economy. By fostering long-term commercial partnerships among reliable partners, Pax Silica aims to expand productive capacity, reduce strategic dependencies, and promote sustainable, market-driven growth.

The opening event will begin at 7:50 a.m. on Thursday, June 25, at the Donald J. Trump Institute of Peace. Senior officials will deliver remarks, announce new initiatives, and participate in a signing ceremony welcoming new Pax Silica partners. The opening session and signing ceremony will be open to credentialed media; all subsequent Summit proceedings will be closed to the press.

/Public Release. This material from the originating organization/author(s) might be of the point-in-time nature, and edited for clarity, style and length. Mirage.News does not take institutional positions or sides, and all views, positions, and conclusions expressed herein are solely those of the author(s).View in full here.