The Department of War announced today a July 2, 2026, investment of $16 million in Defense Production Act (DPA) Title III funds to BAE Systems. The investment will expand the domestic production capability for radiation-hardened microelectronics (RHM) necessary for national defense. This investment supports the Secretary of War's priorities to reestablish deterrence and rebuild the military by investing in key defense industrial base capabilities that increase supply chain resilience.
"Radiation-hardened microelectronics are critical for DoW missile, space, and strategic systems," said Assistant Secretary of War for Industrial Base Policy, the Honorable Michael Cadenazzi. "This project ensures qualified products are available to the DoW."
These DPA Title III funds will enable BAE Systems to create, maintain, protect, and expand domestic industrial base processing and production capabilities and capacity that are essential for RHM components. Specifically, the project will reestablish BAE Systems' RH45® Storefront capability for trusted Radiation Hardened by Design 45nm Application Specific Integrated Circuit and Application Specific Standard Product offerings. Once reestablished, BAE Systems' RH45® Storefront will be a self-sustaining hub where customers can access a range of standard processing products and resources to develop and produce their own custom chips.
"This effort ensures that 45nm silicon-on-insulator technology remains available to DoW systems," added Mr. Jeffrey Frankston, Acting Deputy Assistant Secretary of War for Industrial Base Resilience, who oversees the Warfighting Investment, Resourcing, and Execution (WIRE) directorate. "This provides cost-avoidance, so programs are not forced to redesign and requalify their systems."
