New innovation to keep high-power devices cool

A photo of a printed circuit board

Researchers led by Nanyang Asst Prof Hortense Le Ferrand of NTU's School of Mechanical and Aerospace Engineering have devised a new solution to prevent high-performance electronic devices from overheating.

Using their method, the scientists arranged hexagonal boron nitride nanoparticles in various orientations to strategically channel heat away from their sources.

The scientists say their innovation may pave the way for more effective heat management solutions to keep the next generation of electronic devices cool.

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