Purdue Inks Tech MOUs with Taiwan Universities, Hosts Delegation and Ambassador

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Krach Institute of Tech Diplomacy CEO Michelle Giuda leads a panel discussion with tech industry leaders to delve into how to securely advance emerging and disruptive technologies in both Taiwan and the U.S. (Purdue University photo)

One agreement creates academic research and workforce development opportunities in semiconductors, while the other enhances tech diplomacy efforts

WEST LAFAYETTE, Ind. – In its ongoing efforts to help the U.S. regain preeminence in the semiconductor industry, Purdue University and the Krach Institute for Tech Diplomacy at Purdue on June 15 signed memorandums of understanding with two research universities in Taiwan, the world's largest producer of microchips. The MOUs are in partnership with research universities in Taiwan: National Yang Ming Chiao Tung University (NYCU) in Hsinchu and National Chengchi University (NCCU), a public research university in Taipei.

Purdue President Mung Chiang and NYCU President Chi-Hung Lin signed an MOU to bolster academic research and workforce development efforts in semiconductor-related areas, including NYCU's Semiconductor Workforce Advancement Program. The MOU includes joint research projects, student exchange and internship opportunities, and dual-degree programs.

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"Since Purdue President Hovde's partnership with the National Cheng Kung University in 1953, our university has enjoyed strong relations with universities in Taiwan for seven decades," Chiang said. "The new partnership with NYCU in the area of semiconductors education and research is another milestone in expanding student mobility, faculty collaboration and industry co-innovation. We look forward to many more decades of such exchanges of ideas and talents."

chiang-taiwanPurdue President Mung Chiang and Dr. Chi-hung Lin, President of Taiwan's National Yang Ming Chiao Tung University, signed an MOU to partner in academic research and workforce development efforts in semiconductors. (Purdue University photo: Vincent Walter

The second MOU is between National Chengchi University and the Krach Institute for Tech Diplomacy at Purdue. Signed by Krach Institute CEO Michelle Giuda, the MOU's purpose is to promote international cooperation between the two organizations to underpin their shared values and mission to advance freedom by driving the innovation and adoption of trusted technology.

"Securing freedom requires that we bring together – in new ways – high-tech, private-sector know-how technology expertise, such as the leading STEM students and researchers at Purdue or NYCU and NCCU, and foreign policy and national security expertise," Giuda said. "That integrated expertise and partnership – among public and private partners and allies – is required to secure freedom and secure high tech and why we are so excited to strengthen our partnership with Taiwan."

The ceremony comes two months after a delegation from Taiwan's NYCU visited Purdue with a focus on strengthening the collaboration between the two partners in semiconductor initiatives at both institutions.

Purdue announced in April the formation of the President's Semiconductor Task Force to coordinate and lead Purdue's efforts toward innovative research and development through the CHIPS for America and Science Act. Mark Lundstrom, chief semiconductor officer for Purdue and the Don and Carol Scifres Distinguished Professor of Electrical and Computer Engineering, will lead the task force. The task force is a critical component of the Semiconductors@Purdue

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